Packaging Research and Development Engineer

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. The thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors. Interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

According to JobzMall, the average salary range for a Packaging Research and Development Engineer in Intel RS1, 2501 NE Century Blvd, Hillsboro, OR 97124, USA is $99,833 to $114,347 per year. This range is based on salaries reported by JobzMall users and includes base salary, bonus, and other forms of compensation. This salary range does not factor in other benefits, such as medical insurance, pension, and other employer contributions.

This salary range is slightly higher than the national average for Packaging Research and Development Engineers, which is currently $90,261 to $108,190 per year. The higher salary range may be due to the experience and skill level of Intel RS1’s engineers, or the fact that Intel RS1 is located in an area with a higher cost of living.

Intel Corp. engages in the design, manufacture, and sale of computer products and technologies. It delivers computer, networking, and communications platforms. It operates its business through the following segments: Client Computing Group, Data Center Group, Internet of Things Group, Non-Volatile Memory Solutions Group, Intel Security Group, and Programmable Solutions.